Publication:

Microstructural evolution of Cu interconnect under AC, pulsed DC and DC current stress

Date

2007
Proceedings Paper
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dc.contributor.authorBiesemans, Leen
dc.contributor.authorVanstreels, Kris
dc.contributor.authorBrongersma, Sywert
dc.contributor.authorD'Haen, Jan
dc.contributor.authorDe Ceuninck, Ward
dc.contributor.authorD'Olieslaeger, Marc
dc.contributor.imecauthorVanstreels, Kris
dc.contributor.imecauthorBrongersma, Sywert
dc.contributor.imecauthorD'Haen, Jan
dc.contributor.imecauthorDe Ceuninck, Ward
dc.contributor.imecauthorD'Olieslaeger, Marc
dc.contributor.orcidimecVanstreels, Kris::0000-0002-4420-0966
dc.contributor.orcidimecBrongersma, Sywert::0000-0002-1755-3897
dc.date.accessioned2021-10-16T15:05:50Z
dc.date.available2021-10-16T15:05:50Z
dc.date.embargo9999-12-31
dc.date.issued2007
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/11746
dc.source.beginpage453
dc.source.conferenceAdvanced Metallization Conference 2006
dc.source.conferencedate17/10/2006
dc.source.conferencelocationSan Diego, CA USA
dc.source.endpage458
dc.title

Microstructural evolution of Cu interconnect under AC, pulsed DC and DC current stress

dc.typeProceedings paper
dspace.entity.typePublication
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