Publication:

Bridging the gap between resonance and adiabaticity: a compact and highly tolerant vertical coupling structure

Date

2022
Journal article
https://doi.org/10.1364/PRJ.465765
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dc.contributor.authorYao, Chunhui
dc.contributor.authorCheng, Qixiang
dc.contributor.authorRoelkens, Gunther
dc.contributor.authorPenty, Richard
dc.contributor.imecauthorRoelkens, Gunther
dc.contributor.orcidimecRoelkens, Gunther::0000-0002-4667-5092
dc.date.accessioned2023-03-30T09:58:16Z
dc.date.available2022-12-17T03:12:15Z
dc.date.available2023-03-30T09:58:16Z
dc.date.embargo2022-08-15
dc.date.issued2022
dc.description.wosFundingTextHorizon 2020 Framework Programme (101017088); Engineering and Physical Sciences Research Council (EP/T028475/1).
dc.identifier.doi10.1364/PRJ.465765
dc.identifier.issn2327-9125
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/40882
dc.publisherCHINESE LASER PRESS
dc.source.beginpage2081
dc.source.endpage2090
dc.source.issue9
dc.source.journalPHOTONICS RESEARCH
dc.source.numberofpages10
dc.source.volume10
dc.subject.keywordsGUIDE ATG TECHNOLOGY
dc.subject.keywordsIII-V
dc.subject.keywordsWAVE-GUIDES
dc.subject.keywordsSILICON
dc.subject.keywordsLASER
dc.subject.keywordsINTEGRATION
dc.subject.keywordsINP/INGAASP
dc.subject.keywordsPHOTONICS
dc.subject.keywordsCIRCUITS
dc.subject.keywordsSOI
dc.title

Bridging the gap between resonance and adiabaticity: a compact and highly tolerant vertical coupling structure

dc.typeJournal article
dspace.entity.typePublication
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