Publication:

Comparison of x-ray diffraction, wafer curvature and Raman spectroscopy to evaluate the stress evolution in Copper TSV's

Date

2012
Proceedings Paper
Simple item page Full metadata Statistics
 
dc.contributor.authorWilson, Chris
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorVandevelde, Bart
dc.contributor.authorDe Messemaeker, Joke
dc.contributor.authorAblett, James M.
dc.contributor.authorRedolfi, Augusto
dc.contributor.authorSimons, Veerle
dc.contributor.authorBeyne, Eric
dc.contributor.authorCroes, Kristof
dc.contributor.imecauthorWilson, Chris
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorDe Messemaeker, Joke
dc.contributor.imecauthorRedolfi, Augusto
dc.contributor.imecauthorSimons, Veerle
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorCroes, Kristof
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecSimons, Veerle::0000-0001-5714-955X
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecDe Messemaeker, Joke::0000-0002-4872-0176
dc.date.accessioned2021-10-20T18:59:00Z
dc.date.available2021-10-20T18:59:00Z
dc.date.issued2012
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/21850
dc.source.conferenceIEEE International Interconnect Technology Conference - IITC
dc.source.conferencedate4/06/2012
dc.source.conferencelocationSan Jose, CA USA
dc.title

Comparison of x-ray diffraction, wafer curvature and Raman spectroscopy to evaluate the stress evolution in Copper TSV's

dc.typeProceedings paper
dspace.entity.typePublication
Files
Publication available in collections:
Conference contributions