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Semi-additive Cu-Polymer RDL process for interposers applications
Publication:
Semi-additive Cu-Polymer RDL process for interposers applications
Date
2014
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Duval, Fabrice
;
Detalle, Mikael
;
Sun, Xiao
;
Beyne, Eric
;
Roda Neve, Cesar
;
Velenis, Dimitrios
Journal
Abstract
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1946
since deposited on 2021-10-22
450
item.page.metrics.field.last-week
Acq. date: 2025-10-24
Citations
Metrics
Views
1946
since deposited on 2021-10-22
450
item.page.metrics.field.last-week
Acq. date: 2025-10-24
Citations