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The PSGA, a lead-free CSP for high performance & high reliable packaging
Publication:
The PSGA, a lead-free CSP for high performance & high reliable packaging
Date
2001
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Driessens, Evelien
;
Vandevelde, Bart
;
Chandrasekhar, Arun
;
Beyne, Eric
Journal
Abstract
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2011
since deposited on 2021-10-14
Acq. date: 2025-10-26
Citations
Metrics
Views
2011
since deposited on 2021-10-14
Acq. date: 2025-10-26
Citations