Novel seed layer formation using direct electroless copper deposition on ALD-Ru layer for high aspect ratio TSV

dc.contributor.author	Inoue, Fumihiro
dc.contributor.author	Philipsen, Harold
dc.contributor.author	Radisic, Alex
dc.contributor.author	Armini, Silvia
dc.contributor.author	Civale, Yann
dc.contributor.author	Leunissen, Peter
dc.contributor.author	Shingubara, Shoso
dc.contributor.imecauthor	Inoue, Fumihiro
dc.contributor.imecauthor	Philipsen, Harold
dc.contributor.imecauthor	Radisic, Alex
dc.contributor.imecauthor	Armini, Silvia
dc.contributor.orcidimec	Philipsen, Harold::0000-0002-5029-1104
dc.contributor.orcidimec	Armini, Silvia::0000-0003-0578-3422
dc.date.accessioned	2021-10-20T11:47:48Z
dc.date.available	2021-10-20T11:47:48Z
dc.date.issued	2012
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/20847
dc.identifier.url	http://dx.doi.org/10.1109/IITC.2012.6251660
dc.source.conference	IEEE International Interconnect Technology Conference - IITC
dc.source.conferencedate	4/06/2012
dc.source.conferencelocation	San Jose, CA USA
dc.title	Novel seed layer formation using direct electroless copper deposition on ALD-Ru layer for high aspect ratio TSV
dc.type	Proceedings paper
dspace.entity.type	Publication
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