Publication:
Simulation of Bulge-Out Mechanism Enabling Sub-0.5 μm Scaling of Hybrid Wafer-to-Wafer Bonding
| dc.contributor.author | De Messemaeker, Joke | |
| dc.contributor.author | Van Sever, Koen | |
| dc.contributor.author | Tsau, Yan Wen | |
| dc.contributor.author | Zhang, Boyao | |
| dc.contributor.author | Croes, Kristof | |
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.imecauthor | De Messemaeker, Joke | |
| dc.contributor.imecauthor | Van Sever, Koen | |
| dc.contributor.imecauthor | Zhang, Boyao | |
| dc.contributor.imecauthor | Croes, Kristof | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.orcidimec | De Messemaeker, Joke::0000-0002-4872-0176 | |
| dc.contributor.orcidimec | Zhang, Boyao::0000-0002-7976-0146 | |
| dc.contributor.orcidimec | Croes, Kristof::0000-0002-3955-0638 | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.date.accessioned | 2025-04-10T15:13:36Z | |
| dc.date.available | 2024-12-07T16:57:34Z | |
| dc.date.available | 2025-04-10T15:13:36Z | |
| dc.date.issued | 2024 | |
| dc.identifier.doi | 10.1109/ECTC51529.2024.00310 | |
| dc.identifier.eisbn | 979-8-3503-7598-5 | |
| dc.identifier.isbn | 979-8-3503-7599-2 | |
| dc.identifier.issn | 0569-5503 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/44944 | |
| dc.publisher | IEEE COMPUTER SOC | |
| dc.source.beginpage | 1853 | |
| dc.source.conference | IEEE 74th Electronic Components and Technology Conference (ECTC) | |
| dc.source.conferencedate | MAY 28-31, 2024 | |
| dc.source.conferencelocation | Denver | |
| dc.source.endpage | 1858 | |
| dc.source.journal | N/A | |
| dc.source.numberofpages | 6 | |
| dc.title | Simulation of Bulge-Out Mechanism Enabling Sub-0.5 μm Scaling of Hybrid Wafer-to-Wafer Bonding | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
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