Publication:
Theoretical and experimental Raman spectroscopy study of mechanical stress induced by electronic packaging
Date
| dc.contributor.author | Chen, Jian | |
| dc.contributor.author | De Wolf, Ingrid | |
| dc.contributor.imecauthor | De Wolf, Ingrid | |
| dc.contributor.orcidimec | De Wolf, Ingrid::0000-0003-3822-5953 | |
| dc.date.accessioned | 2021-10-16T00:55:55Z | |
| dc.date.available | 2021-10-16T00:55:55Z | |
| dc.date.issued | 2005 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/10209 | |
| dc.source.beginpage | 484 | |
| dc.source.endpage | 492 | |
| dc.source.issue | 3 | |
| dc.source.journal | IEEE Trans. Components and Packaging Technologies | |
| dc.source.volume | 28 | |
| dc.title | Theoretical and experimental Raman spectroscopy study of mechanical stress induced by electronic packaging | |
| dc.type | Journal article | |
| dspace.entity.type | Publication | |
| Files | ||
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