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NimbleAI: Towards Neuromorphic Sensing-Processing 3D-integrated Chips

 
dc.contributor.authorIturbe, Xabier
dc.contributor.authorAbderrahmane, Nassim
dc.contributor.authorAbella, Jaume
dc.contributor.authorAlcaide, Sergi
dc.contributor.authorBeyne, Eric
dc.contributor.authorCharles, Henri-Pierre
dc.contributor.authorCharpin-Nicolle, Christelle
dc.contributor.authorChittka, Lars
dc.contributor.authorDavila, Angelica
dc.contributor.authorErdmann, Arne
dc.contributor.authorEstrada, Carles
dc.contributor.authorFernandez, Ander
dc.contributor.authorFontanelli, Anna
dc.contributor.authorFlich, Jose
dc.contributor.authorFurano, Gianluca
dc.contributor.authorGloriani, Alejandro Hernan
dc.contributor.authorIsusquiza, Erik
dc.contributor.authorGrosu, Radu
dc.contributor.authorHernandez, Carles
dc.contributor.authorIelmini, Daniele
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorNawghane, Chinmay
dc.contributor.imecauthorvan der Plas, Geert
dc.contributor.imecauthorStörring, Moritz
dc.contributor.imecauthorvan de Burgwal, Marcel
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecNawghane, Chinmay::0000-0002-1867-827X
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecStörring, Moritz::0009-0005-2095-2898
dc.contributor.orcidimecvan de Burgwal, Marcel::0000-0003-0912-7131
dc.date.accessioned2024-06-04T13:47:46Z
dc.date.available2023-08-19T18:10:06Z
dc.date.available2024-06-04T13:47:46Z
dc.date.issued2023
dc.description.wosFundingTextNimbleAI has received funding from the EU's Horizon Europe Research and Innovation programme (Grant Agreement 101070679), and by the UK Research and Innovation (UKRI) under the UK government's Horizon Europe funding guarantee (Grant Agreement 10039070). See: https://www.nimbleai.eu.
dc.identifier.doi10.23919/DATE56975.2023.10136952
dc.identifier.eisbn979-8-3503-9624-9
dc.identifier.issn1530-1591
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/42364
dc.publisherIEEE
dc.source.conferenceDesign, Automation and Test in Europe Conference and Exhibition (DATE)
dc.source.conferencedateAPR 17-19, 2023
dc.source.conferencelocationAntwerpen
dc.source.journalN/A
dc.source.numberofpages6
dc.title

NimbleAI: Towards Neuromorphic Sensing-Processing 3D-integrated Chips

dc.typeProceedings paper
dspace.entity.typePublication
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