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Poly-silicon germanium thin-film package: study of structural features enabling CMOS-MEMS integration

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dc.contributor.authorClaes, Gert
dc.contributor.thesisadvisorCelis, Jean-Pierre
dc.contributor.thesisadvisorVan Hoof, Chris
dc.date.accessioned2021-10-19T12:51:23Z
dc.date.available2021-10-19T12:51:23Z
dc.date.embargo9999-12-31
dc.date.issued2011-07
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18703
dc.title

Poly-silicon germanium thin-film package: study of structural features enabling CMOS-MEMS integration

dc.typePHD thesis
dspace.entity.typePublication
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