Corrosion of the copper damascene interconnects as a function of the electrochemical plating process parameters

dc.contributor.author	Ernur, Didem
dc.contributor.author	Wu, Wen
dc.contributor.author	Brongersma, Sywert
dc.contributor.author	Terzieva, Valentina
dc.contributor.author	Maex, Karen
dc.contributor.imecauthor	Ernur, Didem
dc.contributor.imecauthor	Brongersma, Sywert
dc.contributor.imecauthor	Terzieva, Valentina
dc.contributor.imecauthor	Maex, Karen
dc.contributor.orcidimec	Brongersma, Sywert::0000-0002-1755-3897
dc.date.accessioned	2021-10-15T13:22:25Z
dc.date.available	2021-10-15T13:22:25Z
dc.date.issued	2004
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/8891
dc.source.beginpage	K6.1
dc.source.conference	Advances in Chemical Mechanical Polishing
dc.source.conferencedate	12/04/2004
dc.source.conferencelocation	San Francisco, CA USA
dc.title	Corrosion of the copper damascene interconnects as a function of the electrochemical plating process parameters
dc.type	Proceedings paper
dspace.entity.type	Publication
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