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Design, test generation, processing, and pre- and post-bond measurement results of a 3D-DfT demonstrator chip stack
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Design, test generation, processing, and pre- and post-bond measurement results of a 3D-DfT demonstrator chip stack
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Date
2014
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Marinissen, Erik Jan
;
De Wachter, Bart
;
O'Loughlin, Stephen
;
Deutsch, Sergej
;
Papameletis, Christos
;
Burgherr, Tobias
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1935
since deposited on 2021-10-22
1
last month
Acq. date: 2025-12-10
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Metrics
Views
1935
since deposited on 2021-10-22
1
last month
Acq. date: 2025-12-10
Citations