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Texture characterization of Cu interconnects with different Ta based sidewall diffusion barriers
Publication:
Texture characterization of Cu interconnects with different Ta based sidewall diffusion barriers
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Date
2010
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Wilson, Chris
;
Zhao, Chao
;
Volders, Henny
;
Zhao, Larry
;
Croes, Kristof
;
Tokei, Zsolt
;
Beyer, Gerald
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1841
since deposited on 2021-10-19
2
last month
Acq. date: 2025-12-15
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Metrics
Views
1841
since deposited on 2021-10-19
2
last month
Acq. date: 2025-12-15
Citations