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Materials characterization and device analysis for evaluation of semiconductor processes by highly-sophisticated photoelastic stress measurement technique

Date

2015
Journal article
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dc.contributor.authorHerms, Martin
dc.contributor.authorWagner, Matthias
dc.contributor.authorMolchanov, Alexander
dc.contributor.authorLin, Pinyen
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorZhao, Ming
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorZhao, Ming
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecZhao, Ming::0000-0002-0856-851X
dc.date.accessioned2021-10-22T19:40:44Z
dc.date.available2021-10-22T19:40:44Z
dc.date.issued2015
dc.identifier.issn1610-1634
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/25378
dc.identifier.urlhttp://onlinelibrary.wiley.com/doi/10.1002/pssc.201400356/abstract
dc.source.beginpage1085
dc.source.endpage1089
dc.source.issue8
dc.source.journalPhysica Status Solidi C
dc.source.volume12
dc.title

Materials characterization and device analysis for evaluation of semiconductor processes by highly-sophisticated photoelastic stress measurement technique

dc.typeJournal article
dspace.entity.typePublication
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