Publication:

3D-Printed Direct Liquid Multi-Jet Impingement Cooling Solutions for Power Electronics in Electrified Automotive Transportation

Date

2024
Proceedings Paper
https://doi.org/10.1109/THERMINIC62015.2024.10732871
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dc.contributor.authorMoloudi, Reza
dc.contributor.authorVandevelde, Bart
dc.contributor.authorVerleysen, Willem
dc.contributor.authorCleuren, Silke G. C.
dc.contributor.authorMasquelet, Lucie
dc.contributor.authorSternberg, Maik
dc.contributor.authorStelzer, Adrian
dc.contributor.authorBurghardt, Andreas
dc.contributor.authorGromala, Przemyslaw Jakub
dc.contributor.imecauthorMoloudi, Reza
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.orcidimecMoloudi, Reza::0000-0002-0737-0675
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.date.accessioned2025-06-17T12:21:23Z
dc.date.available2024-12-02T16:50:20Z
dc.date.available2025-06-17T12:21:23Z
dc.date.issued2024
dc.description.wosFundingTextThe project is supported by the Chips Joint Undertaking and its members, including the top -up funding by the national Authorities of Germany, Belgium, Spain, Sweden, Netherlands, Austria, Italy, Greece, Latvia, Finland, Hungary, Romania and Switzerland, under grant agreement number 101096387. Co -funded by European Union.
dc.identifier.doi10.1109/THERMINIC62015.2024.10732871
dc.identifier.eisbn979-8-3503-8782-7
dc.identifier.isbn979-8-3503-8783-4
dc.identifier.issn2474-1515
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/44895
dc.publisherIEEE
dc.source.conference30th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
dc.source.conferencedateSEP 25-27, 2024
dc.source.conferencelocationToulouse
dc.source.journalN/A
dc.source.numberofpages4
dc.title

3D-Printed Direct Liquid Multi-Jet Impingement Cooling Solutions for Power Electronics in Electrified Automotive Transportation

dc.typeProceedings paper
dspace.entity.typePublication
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