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Engineering self assembled monolayer as copper diffusion barrier: Cu/NH2-SAM/SiO2 interface characterization

Date

2008
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dc.contributor.authorMaestre Caro, Arantxa
dc.date.accessioned2021-10-17T08:40:25Z
dc.date.available2021-10-17T08:40:25Z
dc.date.issued2008
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/14094
dc.source.conferenceInternational symposium of surface science and nanotechnology - ISSS-5
dc.source.conferencedate9/11/2008
dc.source.conferencelocationTokyo Japan
dc.title

Engineering self assembled monolayer as copper diffusion barrier: Cu/NH2-SAM/SiO2 interface characterization

dc.typeMeeting abstract
dspace.entity.typePublication
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