Publication:

In-line metrology for characterization and control of extreme wafer thinning of bonded wafers

Date

2017
Proceedings Paper
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dc.contributor.authorLiebens, Maarten
dc.contributor.authorJourdain, Anne
dc.contributor.authorDe Vos, Joeri
dc.contributor.authorVandeweyer, Tom
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyne, Eric
dc.contributor.authorLi, Shifang
dc.contributor.authorBast, G.
dc.contributor.authorStoerring, Moritz
dc.contributor.authorHiebert, S.
dc.contributor.authorCross, Andrew
dc.contributor.imecauthorLiebens, Maarten
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorDe Vos, Joeri
dc.contributor.imecauthorVandeweyer, Tom
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorStoerring, Moritz
dc.contributor.imecauthorCross, Andrew
dc.contributor.orcidimecDe Vos, Joeri::0000-0002-9332-9336
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-24T07:59:49Z
dc.date.available2021-10-24T07:59:49Z
dc.date.embargo9999-12-31
dc.date.issued2017
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/28825
dc.identifier.urlhttp://ieeexplore.ieee.org/document/7969255/
dc.source.beginpage331
dc.source.conference28th Annual SEMI Advanced Semiconductor Manufacturing Conference - ASMC
dc.source.conferencedate15/05/2017
dc.source.conferencelocationSaratoga Springs, NY USA
dc.source.endpage336
dc.title

In-line metrology for characterization and control of extreme wafer thinning of bonded wafers

dc.typeProceedings paper
dspace.entity.typePublication
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