Skip to content
Institutional repository
Communities & Collections
Browse all items
Scientific publications
Open knowledge
Log In
imec Publications
Articles
Using non-stretchable structures for component positioning in thermoformed electronics
Publication:
Using non-stretchable structures for component positioning in thermoformed electronics
Copy permalink
Date
2022
Journal article
https://doi.org/10.1088/2058-8585/ac86e1
Simple item page
Full metadata
Statistics
Loading...
Loading...
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Madadnia, Behnam
;
Bossuyt, Frederick
;
Vanfleteren, Jan
Journal
FLEXIBLE AND PRINTED ELECTRONICS
Abstract
Description
Metrics
Views
1498
since deposited on 2022-08-27
2
last month
Acq. date: 2025-12-15
Citations
Metrics
Views
1498
since deposited on 2022-08-27
2
last month
Acq. date: 2025-12-15
Citations