Publication:

Improved low-k dielectric properties using He/H2 plasma for resist removal

Date

2009
Proceedings Paper
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dc.contributor.authorUrbanowicz, Adam
dc.contributor.authorShamiryan, Denis
dc.contributor.authorMarsik, Premysl
dc.contributor.authorTravaly, Youssef
dc.contributor.authorJonas, Alain
dc.contributor.authorVerdonck, Patrick
dc.contributor.authorVanstreels, Kris
dc.contributor.authorFerchichi, Abdelkarim
dc.contributor.authorDe Roest, David
dc.contributor.authorSprey, Hessel
dc.contributor.authorMatsushita, Kiyohiro
dc.contributor.authorKaneko, Shinya
dc.contributor.authorTsuji, Naoto
dc.contributor.authorLuo, Shijian
dc.contributor.authorEscorcia, Orlando
dc.contributor.authorBerry, Ivan
dc.contributor.authorWaldfried, Carlo
dc.contributor.authorDe Gendt, Stefan
dc.contributor.authorBaklanov, Mikhaïl
dc.contributor.imecauthorVerdonck, Patrick
dc.contributor.imecauthorVanstreels, Kris
dc.contributor.imecauthorDe Roest, David
dc.contributor.imecauthorSprey, Hessel
dc.contributor.imecauthorDe Gendt, Stefan
dc.contributor.orcidimecVerdonck, Patrick::0000-0003-2454-0602
dc.contributor.orcidimecVanstreels, Kris::0000-0002-4420-0966
dc.contributor.orcidimecDe Gendt, Stefan::0000-0003-3775-3578
dc.date.accessioned2021-10-18T03:48:42Z
dc.date.available2021-10-18T03:48:42Z
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/16335
dc.source.beginpage593
dc.source.conferenceAdvanced Metallization Conference 2008 (AMC 2008)
dc.source.conferencedate22/09/2008
dc.source.conferencelocationSan Diego, CA USA
dc.source.endpage598
dc.title

Improved low-k dielectric properties using He/H2 plasma for resist removal

dc.typeProceedings paper
dspace.entity.typePublication
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