Publication:

Seed-less copper electrochemical deposition on barrier materials as a replacement/enhancement for PVD Cu seed layers in HAR TSVs

Date

2010
Meeting abstract
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dc.contributor.authorArmini, Silvia
dc.contributor.authorPhilipsen, Harold
dc.contributor.authorEl-Mekki, Zaid
dc.contributor.authorRedolfi, Augusto
dc.contributor.authorVan Ammel, Annemie
dc.contributor.authorRadisic, Alex
dc.contributor.authorNagar, Magi
dc.contributor.authorRuythooren, Wouter
dc.contributor.imecauthorArmini, Silvia
dc.contributor.imecauthorPhilipsen, Harold
dc.contributor.imecauthorEl-Mekki, Zaid
dc.contributor.imecauthorRedolfi, Augusto
dc.contributor.imecauthorVan Ammel, Annemie
dc.contributor.imecauthorRadisic, Alex
dc.contributor.imecauthorRuythooren, Wouter
dc.contributor.orcidimecArmini, Silvia::0000-0003-0578-3422
dc.contributor.orcidimecPhilipsen, Harold::0000-0002-5029-1104
dc.date.accessioned2021-10-18T15:16:04Z
dc.date.available2021-10-18T15:16:04Z
dc.date.embargo9999-12-31
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/16664
dc.source.beginpage1280
dc.source.conference217th ECS Meeting Symposium 'Electrochemical Engineering for the 21st Century '
dc.source.conferencedate24/04/2010
dc.source.conferencelocationVancouver Canada
dc.title

Seed-less copper electrochemical deposition on barrier materials as a replacement/enhancement for PVD Cu seed layers in HAR TSVs

dc.typeMeeting abstract
dspace.entity.typePublication
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