Publication:
Modelling complex via hole structures
Date
| dc.contributor.author | Laermans, Eric | |
| dc.contributor.author | De Geest, Jan | |
| dc.contributor.author | De Zutter, Daniel | |
| dc.contributor.author | Olyslager, Frank | |
| dc.contributor.author | Sercu, Jeannick | |
| dc.contributor.author | Morlion, D. | |
| dc.contributor.imecauthor | Laermans, Eric | |
| dc.contributor.imecauthor | De Zutter, Daniel | |
| dc.contributor.orcidimec | Laermans, Eric::0000-0002-1811-9419 | |
| dc.date.accessioned | 2021-10-14T17:11:34Z | |
| dc.date.available | 2021-10-14T17:11:34Z | |
| dc.date.issued | 2001 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/5415 | |
| dc.source.beginpage | 149 | |
| dc.source.conference | Proceedings of the IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging - EPEP | |
| dc.source.conferencedate | 29/10/2001 | |
| dc.source.conferencelocation | Cambridge, MA USA | |
| dc.source.endpage | 152 | |
| dc.title | Modelling complex via hole structures | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
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