Publication:

Wafer to wafer bonding using CuSn microbumps for GaN-LED substrate transfer process

Date

2014
Proceedings Paper
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dc.contributor.authorPham, Nga
dc.contributor.authorSoussan, Philippe
dc.contributor.authorPeng, Lan
dc.contributor.authorRosmeulen, Maarten
dc.contributor.authorSabuncuoglu Tezcan, Deniz
dc.contributor.imecauthorPham, Nga
dc.contributor.imecauthorSoussan, Philippe
dc.contributor.imecauthorPeng, Lan
dc.contributor.imecauthorRosmeulen, Maarten
dc.contributor.imecauthorSabuncuoglu Tezcan, Deniz
dc.contributor.orcidimecSoussan, Philippe::0000-0002-1347-6978
dc.contributor.orcidimecPeng, Lan::0000-0003-1824-126X
dc.contributor.orcidimecRosmeulen, Maarten::0000-0002-3663-7439
dc.contributor.orcidimecSabuncuoglu Tezcan, Deniz::0000-0002-9237-7862
dc.date.accessioned2021-10-22T04:43:52Z
dc.date.available2021-10-22T04:43:52Z
dc.date.embargo9999-12-31
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/24383
dc.source.beginpage326
dc.source.conference16th IEEE Electronics Packaging Technology Conference
dc.source.conferencedate3/12/2014
dc.source.conferencelocationSingapore Singapore
dc.source.endpage329
dc.title

Wafer to wafer bonding using CuSn microbumps for GaN-LED substrate transfer process

dc.typeProceedings paper
dspace.entity.typePublication
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