Publication:
Thermal cycling reliability of SnAgCu and SnPb solder joints: a comparison for several IC-packages,
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1856 since deposited on 2021-10-16
2last month
Acq. date: 2026-04-06
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Statistics
Views
1856 since deposited on 2021-10-16
2last month
Acq. date: 2026-04-06
Citations