Publication:

A Parylene temporary packaging technique for MEMS wafer handling

Date

2011
Proceedings Paper
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dc.contributor.authorWen, L.
dc.contributor.authorWouters, K.
dc.contributor.authorCeyssens, F.
dc.contributor.authorWitvrouw, Ann
dc.contributor.authorPuers, Bob
dc.contributor.imecauthorPuers, Bob
dc.date.accessioned2021-10-19T21:46:38Z
dc.date.available2021-10-19T21:46:38Z
dc.date.embargo9999-12-31
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/20144
dc.identifier.urlwww.sciencedirect.com
dc.source.beginpage1501
dc.source.conferenceEurosensors XXV
dc.source.conferencedate4/09/2011
dc.source.conferencelocationAthens Greece
dc.source.endpage1504
dc.title

A Parylene temporary packaging technique for MEMS wafer handling

dc.typeProceedings paper
dspace.entity.typePublication
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