Publication:
High density multilayer thin film interconnect technologies for SiP
Date
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.date.accessioned | 2021-10-15T12:43:24Z | |
| dc.date.available | 2021-10-15T12:43:24Z | |
| dc.date.issued | 2004 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/8579 | |
| dc.source.conference | ENCAST Workshop | |
| dc.source.conferencedate | 26/05/2004 | |
| dc.source.conferencelocation | Villach Austria | |
| dc.title | High density multilayer thin film interconnect technologies for SiP | |
| dc.type | Oral presentation | |
| dspace.entity.type | Publication | |
| Files | ||
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