Publication:
Chemical modification of buildup epoxy surfaces for altering the adhesion of electrochemically deposited copper
Date
| dc.contributor.author | Siau, S. | |
| dc.contributor.author | Vervaet, A. | |
| dc.contributor.author | Schacht, E. | |
| dc.contributor.author | Callewaert, K. | |
| dc.contributor.author | Van Calster, Andre | |
| dc.contributor.author | Degrande, S. | |
| dc.contributor.imecauthor | Van Calster, Andre | |
| dc.date.accessioned | 2021-10-16T05:01:17Z | |
| dc.date.available | 2021-10-16T05:01:17Z | |
| dc.date.issued | 2005 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/11197 | |
| dc.source.beginpage | d136 | |
| dc.source.endpage | d150 | |
| dc.source.issue | 9 | |
| dc.source.journal | Journal of the Electrochemical Society | |
| dc.source.volume | 152 | |
| dc.title | Chemical modification of buildup epoxy surfaces for altering the adhesion of electrochemically deposited copper | |
| dc.type | Journal article | |
| dspace.entity.type | Publication | |
| Files | ||
| Publication available in collections: |