Publication:

Electromigration and thermal storage study of barrierless Co vias

Date

2018
Proceedings Paper
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dc.contributor.authorVarela Pedreira, Olalla
dc.contributor.authorCroes, Kristof
dc.contributor.authorZahedmanesh, Houman
dc.contributor.authorVandersmissen, Kevin
dc.contributor.authorvan der Veen, Marleen
dc.contributor.authorVega Gonzalez, Victor
dc.contributor.authorDictus, Dries
dc.contributor.authorZhao, Larry
dc.contributor.authorKolics, Artur
dc.contributor.authorTokei, Zsolt
dc.contributor.imecauthorVarela Pedreira, Olalla
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorZahedmanesh, Houman
dc.contributor.imecauthorVandersmissen, Kevin
dc.contributor.imecauthorvan der Veen, Marleen
dc.contributor.imecauthorVega Gonzalez, Victor
dc.contributor.imecauthorDictus, Dries
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecvan der Veen, Marleen::0000-0002-9402-8922
dc.contributor.orcidimecDictus, Dries::0000-0002-7896-1747
dc.date.accessioned2021-10-26T08:06:00Z
dc.date.available2021-10-26T08:06:00Z
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/32159
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8430396
dc.source.beginpage48
dc.source.conferenceIEEE International Interconnect Technology Conference - IITC
dc.source.conferencedate4/06/2018
dc.source.conferencelocationSanta Clara, CA USA
dc.source.endpage50
dc.title

Electromigration and thermal storage study of barrierless Co vias

dc.typeProceedings paper
dspace.entity.typePublication
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