Publication:

Assembly of ultra-thin chip packages (UTCPs) for enhanced flexibility of flexible displays

Date

2008-09
Proceedings Paper
Simple item page Full metadata Statistics
 
dc.contributor.authorGovaerts, Jonathan
dc.contributor.authorVanfleteren, Jan
dc.contributor.imecauthorGovaerts, Jonathan
dc.contributor.imecauthorVanfleteren, Jan
dc.contributor.orcidimecGovaerts, Jonathan::0000-0002-8908-1198
dc.contributor.orcidimecVanfleteren, Jan::0000-0002-9654-7304
dc.date.accessioned2021-10-17T07:22:49Z
dc.date.available2021-10-17T07:22:49Z
dc.date.embargo9999-12-31
dc.date.issued2008-09
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/13800
dc.source.beginpage309
dc.source.conferenceProceedings of the 2nd Electronics System Integration Technology Conference - ESTC
dc.source.conferencelocationGreenwich UK
dc.source.endpage313
dc.title

Assembly of ultra-thin chip packages (UTCPs) for enhanced flexibility of flexible displays

dc.typeProceedings paper
dspace.entity.typePublication
Files

Original bundle

Name:
17349.pdf
Size:
847.41 KB
Format:
Adobe Portable Document Format
Download
Publication available in collections:
Conference contributions