Publication:
Dielectric Reliability Study of 21 nm Pitch Interconnects with Barrierless Ru Fill
Date
| dc.contributor.author | Lesniewska, Alicja | |
| dc.contributor.author | Roussel, Philippe | |
| dc.contributor.author | Tierno, Davide | |
| dc.contributor.author | Vega Gonzalez, Victor | |
| dc.contributor.author | van der Veen, Marleen | |
| dc.contributor.author | Verdonck, Patrick | |
| dc.contributor.author | Jourdan, Nicolas | |
| dc.contributor.author | Wilson, Chris | |
| dc.contributor.author | Tokei, Zsolt | |
| dc.contributor.author | Croes, Kristof | |
| dc.contributor.imecauthor | Lesniewska, A. | |
| dc.contributor.imecauthor | Roussel, P. J. | |
| dc.contributor.imecauthor | Tierno, D. | |
| dc.contributor.imecauthor | Gonzalez, V. Vega | |
| dc.contributor.imecauthor | van der Veen, M. H. | |
| dc.contributor.imecauthor | Verdonck, P. | |
| dc.contributor.imecauthor | Jourdan, N. | |
| dc.contributor.imecauthor | Wilson, C. J. | |
| dc.contributor.imecauthor | Tokei, Zs | |
| dc.contributor.imecauthor | Croes, K. | |
| dc.contributor.imecauthor | Lesniewska, Alicja | |
| dc.contributor.imecauthor | Roussel, Philippe | |
| dc.contributor.imecauthor | Tierno, Davide | |
| dc.contributor.imecauthor | Vega Gonzalez, Victor | |
| dc.contributor.imecauthor | van der Veen, Marleen | |
| dc.contributor.imecauthor | Verdonck, Patrick | |
| dc.contributor.imecauthor | Jourdan, Nicolas | |
| dc.contributor.imecauthor | Wilson, Chris | |
| dc.contributor.imecauthor | Tokei, Zsolt | |
| dc.contributor.imecauthor | Croes, Kristof | |
| dc.contributor.orcidimec | Tierno, D.::0000-0003-4915-904X | |
| dc.contributor.orcidimec | Lesniewska, Alicja::0000-0003-3863-065X | |
| dc.contributor.orcidimec | Roussel, Philippe::0000-0002-0402-8225 | |
| dc.contributor.orcidimec | Tierno, Davide::0000-0003-4915-904X | |
| dc.contributor.orcidimec | van der Veen, Marleen::0000-0002-9402-8922 | |
| dc.contributor.orcidimec | Verdonck, Patrick::0000-0003-2454-0602 | |
| dc.contributor.orcidimec | Croes, Kristof::0000-0002-3955-0638 | |
| dc.date.accessioned | 2022-01-07T11:57:34Z | |
| dc.date.available | 2021-11-02T16:05:23Z | |
| dc.date.available | 2022-01-07T11:57:34Z | |
| dc.date.issued | 2020 | |
| dc.identifier.eisbn | 978-1-7281-3199-3 | |
| dc.identifier.issn | 1541-7026 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/38210 | |
| dc.publisher | IEEE | |
| dc.source.conference | IEEE International Reliability Physics Symposium (IRPS) | |
| dc.source.conferencedate | APR 28-MAY 30, 2020 | |
| dc.source.conferencelocation | Virtual | |
| dc.source.journal | na | |
| dc.source.numberofpages | 6 | |
| dc.subject.keywords | K DIELECTRICS | |
| dc.title | Dielectric Reliability Study of 21 nm Pitch Interconnects with Barrierless Ru Fill | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
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