Publication:

Alternative Cu pillar bumps design to reduce thermomechanical stress induced during flip chip assembly

Date

2017

Proceedings Paper

Simple item page Full metadata Statistics

Files

35019.pdf 23.46 MB

Author(s)

Lofrano, Melina

;

Cherman, Vladimir

;

Gonzalez, Mario

;

Statistics

1958 since deposited on 2021-10-24

Acq. date: 2026-02-27