Publication:
Failure analysis and process improvement for through silicon via interconnects
Date
| dc.contributor.author | Majeed, Bivragh | |
| dc.contributor.author | Van Cauwenberghe, Marc | |
| dc.contributor.author | Sabuncuoglu Tezcan, Deniz | |
| dc.contributor.author | Soussan, Philippe | |
| dc.contributor.imecauthor | Majeed, Bivragh | |
| dc.contributor.imecauthor | Van Cauwenberghe, Marc | |
| dc.contributor.imecauthor | Sabuncuoglu Tezcan, Deniz | |
| dc.contributor.imecauthor | Soussan, Philippe | |
| dc.contributor.orcidimec | Sabuncuoglu Tezcan, Deniz::0000-0002-9237-7862 | |
| dc.contributor.orcidimec | Soussan, Philippe::0000-0002-1347-6978 | |
| dc.date.accessioned | 2021-10-18T00:24:55Z | |
| dc.date.available | 2021-10-18T00:24:55Z | |
| dc.date.issued | 2009 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/15789 | |
| dc.source.beginpage | 1156-D08-04 | |
| dc.source.conference | Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics | |
| dc.source.conferencedate | 13/04/2009 | |
| dc.source.conferencelocation | San Francisco, CA USA | |
| dc.title | Failure analysis and process improvement for through silicon via interconnects | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
| Publication available in collections: |