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Optimizing Au and In micro-bumping for 3D chip stacking
Publication:
Optimizing Au and In micro-bumping for 3D chip stacking
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Date
2008
Proceedings Paper
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15464.pdf
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Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Zhang, Wenqi
;
Matin, Abdul
;
Ruythooren, Wouter
;
Beyne, Eric
Journal
Abstract
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1837
since deposited on 2021-10-17
Acq. date: 2026-01-08
Citations
Metrics
Views
1837
since deposited on 2021-10-17
Acq. date: 2026-01-08
Citations