Publication:

Experimental thermal characterisation of electronic components by means of the submerged double jet impingement (SDJI) method

Date

1997
Proceedings Paper
Simple item page Full metadata Statistics
 
dc.contributor.authorChristiaens, Filip
dc.contributor.authorBeyne, Eric
dc.contributor.authorVandevelde, Bart
dc.contributor.authorRoggen, Jean
dc.contributor.authorMertens, Robert
dc.contributor.authorTemmerman, W.
dc.contributor.authorNelemans, W.
dc.contributor.authorLauwers, E.
dc.contributor.authorAllaert, K.
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorMertens, Robert
dc.date.accessioned2021-09-30T08:00:06Z
dc.date.available2021-09-30T08:00:06Z
dc.date.embargo9999-12-31
dc.date.issued1997
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/1768
dc.source.beginpage254
dc.source.conferenceInternational Systems Packaging Symposium - ISPS
dc.source.conferencedate2/12/1997
dc.source.conferencelocationSan Diego, CA USA
dc.source.endpage259
dc.title

Experimental thermal characterisation of electronic components by means of the submerged double jet impingement (SDJI) method

dc.typeProceedings paper
dspace.entity.typePublication
Files

Original bundle

Name:
1736.pdf
Size:
379.59 KB
Format:
Adobe Portable Document Format
Download
Publication available in collections:
Conference contributions