Publication:

Wafer-level-integrated vertical-waveguide sub-diffraction-limited color splitters

 
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dc.contributor.authorKang, S.
dc.contributor.authorBenelajla, M.
dc.contributor.authorMac Ciarnain, Rossa
dc.contributor.authorAli, Farhan
dc.contributor.authorPapadopoulou, Athina
dc.contributor.authorShramkova, Oksana
dc.contributor.authorWitters, Liesbeth
dc.contributor.authorDe Vos, Joeri
dc.contributor.authorMalinowski, Pawel
dc.contributor.authorHeremans, Paul
dc.contributor.authorLe Thomas, Nicolas
dc.contributor.authorFigeys, Bruno
dc.contributor.authorGehlhaar, Robert
dc.contributor.authorGenoe, Jan
dc.date.accessioned2026-05-04T07:38:50Z
dc.date.available2026-05-04T07:38:50Z
dc.date.createdwos2026-03-24
dc.date.issued2023
dc.description.abstractWe demonstrate a new technology for splitting colors with sub-micron resolution using standard backend processing on 300 mm wafers. The color splitting is tunable via the geometry and can be designed to correspond to the color sensitivity of the human eye. The technology can result in: higher signal-to-noise ratio, better color quality and enhanced resolution for high-end cameras.
dc.description.wosFundingTextWe acknowledge the financial support from the Fund for Scientific Research Flanders (FWO) under Project number S004322N (GigaPixel).
dc.identifier.doi10.1109/iedm45741.2023.10413746
dc.identifier.issn2380-9248
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/59268
dc.language.isoeng
dc.provenance.editstepusergreet.vanhoof@imec.be
dc.publisherIEEE
dc.source.conferenceInternational Electron Devices Meeting (IEDM)
dc.source.conferencedate2023-12-09
dc.source.conferencelocationSan Francisco
dc.source.journal2023 INTERNATIONAL ELECTRON DEVICES MEETING, IEDM
dc.source.numberofpages4
dc.title

Wafer-level-integrated vertical-waveguide sub-diffraction-limited color splitters

dc.typeProceedings paper
dspace.entity.typePublication
imec.internal.crawledAt2026-04-07
imec.internal.sourcecrawler
imec.internal.wosCreatedAt2026-04-07
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