Publication:

Wafer probing on fine-pitch micro-bumps for 2.5D- and 3D-SICs

Date

2011
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dc.contributor.authorMarinissen, Erik Jan
dc.contributor.authorDaenen, Tom
dc.contributor.authorDupas, Luc
dc.contributor.authorVan Dievel, Marc
dc.contributor.authorHanaway, Peter
dc.contributor.authorKiesewetter, Joerg
dc.contributor.authorSmith, Ken
dc.contributor.authorStrid, Eric
dc.contributor.authorThaerigen, Thomas
dc.contributor.imecauthorMarinissen, Erik Jan
dc.contributor.imecauthorDaenen, Tom
dc.contributor.imecauthorDupas, Luc
dc.contributor.imecauthorVan Dievel, Marc
dc.contributor.orcidimecMarinissen, Erik Jan::0000-0002-5058-8303
dc.date.accessioned2021-10-19T16:04:23Z
dc.date.available2021-10-19T16:04:23Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/19388
dc.identifier.urlhttp://www.swtest.org/
dc.source.conferenceIEEE Semiconductor Wafer Test Workshop - SWTW
dc.source.conferencedate10/06/2011
dc.source.conferencelocationSan Diego, CA USA
dc.title

Wafer probing on fine-pitch micro-bumps for 2.5D- and 3D-SICs

dc.typeOral presentation
dspace.entity.typePublication
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