Publication:

Beyond BEOL interconnect wafer level monolithic near-infrared/infrared thin film photo diode image sensor integration

Date

2019
Proceedings Paper
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dc.contributor.authorLi, Yunlong
dc.contributor.authorCheyns, David
dc.contributor.authorMoreno Hagelsieb, Luis
dc.contributor.authorGeorgitzikis, Epimitheas
dc.contributor.authorLim, Myung jin
dc.contributor.authorMao, Ming
dc.contributor.authorWitters, Thomas
dc.contributor.authorLeyssens, Kenny
dc.contributor.authorBoulenc, Pierre
dc.contributor.authorLee, Jiwon
dc.contributor.authorMalinowski, Pawel
dc.contributor.authorGuerrieri, Stefano
dc.contributor.imecauthorLi, Yunlong
dc.contributor.imecauthorCheyns, David
dc.contributor.imecauthorMoreno Hagelsieb, Luis
dc.contributor.imecauthorGeorgitzikis, Epimitheas
dc.contributor.imecauthorLim, Myung jin
dc.contributor.imecauthorMao, Ming
dc.contributor.imecauthorWitters, Thomas
dc.contributor.imecauthorLeyssens, Kenny
dc.contributor.imecauthorBoulenc, Pierre
dc.contributor.imecauthorLee, Jiwon
dc.contributor.imecauthorMalinowski, Pawel
dc.contributor.orcidimecLi, Yunlong::0000-0003-4791-4013
dc.contributor.orcidimecCheyns, David::0000-0002-1327-8752
dc.contributor.orcidimecGeorgitzikis, Epimitheas::0000-0001-5972-8328
dc.contributor.orcidimecLee, Jiwon::0000-0003-3738-4872
dc.contributor.orcidimecMalinowski, Pawel::0000-0002-2934-470X
dc.date.accessioned2021-10-27T12:39:13Z
dc.date.available2021-10-27T12:39:13Z
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/33439
dc.identifier.urlhttps://iitc-conference.org/2019-iitc-mam-program/
dc.source.beginpage4.38
dc.source.conferenceIEEE International Interconnect Technology Conference (IITC 2019) and Materials for Advanced Metallization Conference (MAM 2019)
dc.source.conferencedate3/06/2019
dc.source.conferencelocationBrussels Belgium
dc.title

Beyond BEOL interconnect wafer level monolithic near-infrared/infrared thin film photo diode image sensor integration

dc.typeProceedings paper
dspace.entity.typePublication
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