Publication:
Solder parameter sensitivity for CSP life-time prediction using simulation-based optimisation method
Date
| dc.contributor.author | Vandevelde, Bart | |
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.author | Zhang, K.G.Q. | |
| dc.contributor.author | Caers, J.F.J.M. | |
| dc.contributor.author | Vandepitte, D. | |
| dc.contributor.author | Baelmans, Martine | |
| dc.contributor.imecauthor | Vandevelde, Bart | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.orcidimec | Vandevelde, Bart::0000-0002-6753-6438 | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.date.accessioned | 2021-10-14T23:46:53Z | |
| dc.date.available | 2021-10-14T23:46:53Z | |
| dc.date.issued | 2002 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/6992 | |
| dc.source.beginpage | 318 | |
| dc.source.endpage | 325 | |
| dc.source.issue | 4 | |
| dc.source.journal | IEEE Trans. Electronics Packaging Manufacturing | |
| dc.source.volume | 25 | |
| dc.title | Solder parameter sensitivity for CSP life-time prediction using simulation-based optimisation method | |
| dc.type | Journal article | |
| dspace.entity.type | Publication | |
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