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In-line metrology and inspection for process control during 3D stacking of IC�s

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dc.contributor.authorHalder, Sandip
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorMiller, Andy
dc.contributor.authorMaenhoudt, Mireille
dc.contributor.authorBeyer, Gerald
dc.contributor.authorSwinnen, Bart
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorHalder, Sandip
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorSwinnen, Bart
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecHalder, Sandip::0000-0002-6314-2685
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-20T11:25:16Z
dc.date.available2021-10-20T11:25:16Z
dc.date.embargo9999-12-31
dc.date.issued2012
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/20769
dc.source.beginpageP-1-32
dc.source.conferenceIEEE International 3D System Integration Conference - 3DIC
dc.source.conferencedate31/01/2012
dc.source.conferencelocationOsaka Japan
dc.title

In-line metrology and inspection for process control during 3D stacking of IC�s

dc.typeProceedings paper
dspace.entity.typePublication
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