Publication:

Evaluation of TSV and micro-bump probing for wide I/O testing

Date

2011-09
Proceedings Paper
Simple item page Full metadata Statistics
 
dc.contributor.authorSmith, Ken
dc.contributor.authorHanaway, Peter
dc.contributor.authorJolley, Mike
dc.contributor.authorGleason, Reed
dc.contributor.authorStrid, Eric
dc.contributor.authorDaenen, Tom
dc.contributor.authorDupas, Luc
dc.contributor.authorKnuts, Bruno
dc.contributor.authorMarinissen, Erik Jan
dc.contributor.authorVan Dievel, Marc
dc.contributor.imecauthorDaenen, Tom
dc.contributor.imecauthorDupas, Luc
dc.contributor.imecauthorKnuts, Bruno
dc.contributor.imecauthorMarinissen, Erik Jan
dc.contributor.imecauthorVan Dievel, Marc
dc.contributor.orcidimecMarinissen, Erik Jan::0000-0002-5058-8303
dc.date.accessioned2021-10-19T19:03:05Z
dc.date.available2021-10-19T19:03:05Z
dc.date.issued2011-09
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/19809
dc.source.conferenceIEEE International Test Conference - ITC
dc.source.conferencedate20/09/2011
dc.source.conferencelocationAnaheim, CA USA
dc.title

Evaluation of TSV and micro-bump probing for wide I/O testing

dc.typeProceedings paper
dspace.entity.typePublication
Files
Publication available in collections:
Conference contributions