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Understanding and Modeling the Impact of Defects on Electrical Characteristics of Si/SiGe Heterostructures at Cryogenic temperatures

 
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dc.contributor.authorVeryser, Bram
dc.contributor.authorStampfl, Felix
dc.contributor.authorGonzalez-Medina, J.M.
dc.contributor.authorGodfrin, Clement
dc.contributor.authorRaes, Bart
dc.contributor.authorDe Greve, Kristiaan
dc.contributor.authorLoo, Roger
dc.contributor.authorShimura, Yosuke
dc.contributor.authorPanarella, Luca
dc.contributor.authorGrill, Alexander
dc.contributor.authorHoussa, Michel
dc.contributor.authorTyaginov, Stanislav
dc.date.accessioned2026-10-28T14:55:01Z
dc.date.available2026-10-28T14:55:01Z
dc.date.createdwos2026
dc.date.issued2026
dc.description.abstractSi/SiGe heterostructures are a promising platform for electron spin based quantum computers. In this work, we show that the dielectric trapping of these devices can be studied with a phenomenological approach based on employment of effective charges at channel interfaces. We consider a device as consisting of two independent channels: one in the Si quantum well and another one in the Si capping layer. For each channel we use compact models to extract the respective characteristics including the threshold voltage, gate oxide capacitance, and channel mobility. By employing these parameters in our device simulator, we can model the hysteretic capacitance-voltage and current-voltage characteristics at cryogenic temperatures. Within this methodology, we extract a mobility value of both the Si quantum well and the interface channel and correlate them with defect density and barrier thickness. Next, we evaluate the interface state energy distribution, which shows a strong peak around 0.2 eV below the conduction band minimum and a peak value of 4 × 1013 cm−2eV−1. Our interface state energy distribution profiles are in good agreement with those reported in the literature, which supports our hypothesis that the hysteresis is driven by interface traps.
dc.description.wosFundingTextThis work was supported in part by the Chips JU Project ARCTIC under Project 101139908; in part by the Chips Joint Undertaking and its members (including top-up funding by Belgium, Austria, Germany, Estonia, Finland, France, Ireland, The Netherlands, and Sweden); in part by the ARCTIC through Canadian and the Swiss Federal Governments; and in part by IMEC's Industrial Affiliation Program on Quantum Computing and Cryoelectronics.
dc.identifier.doi10.1109/tdmr.2026.3708182
dc.identifier.eissn1558-2574
dc.identifier.issn1530-4388
dc.identifier.issn1558-2574
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/60636
dc.language.isoeng
dc.provenance.editstepusergreet.vanhoof@imec.be
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
dc.source.beginpage689
dc.source.endpage696
dc.source.issue3
dc.source.journalIEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY
dc.source.numberofpages8
dc.source.volume26
dc.subject.keywordsENERGY-DISTRIBUTION
dc.subject.keywordsTRAP DENSITY
dc.title

Understanding and Modeling the Impact of Defects on Electrical Characteristics of Si/SiGe Heterostructures at Cryogenic temperatures

dc.typeJournal article
dspace.entity.typePublication
imec.internal.crawledAt2026-06-30
imec.internal.sourcecrawler
imec.internal.wosCreatedAt2026-10-26
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