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Post dry-etch cleaning issues of an organic low-K dielectric

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dc.contributor.authorLanckmans, Filip
dc.contributor.authorBaklanov, Mikhaïl
dc.contributor.authorAlaerts, Carine
dc.contributor.authorVanhaelemeersch, Serge
dc.contributor.authorMaex, Karen
dc.contributor.imecauthorVanhaelemeersch, Serge
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecVanhaelemeersch, Serge::0000-0003-2102-7395
dc.date.accessioned2021-10-06T11:40:32Z
dc.date.available2021-10-06T11:40:32Z
dc.date.embargo9999-12-31
dc.date.issued1999
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/3606
dc.source.beginpage89
dc.source.conferenceUltra Clean Processing of Silicon Surfaces; Proceedings of the 4th International Symposium on Ultra Clean Processing of Silicon
dc.source.conferencedate21/09/1998
dc.source.conferencelocationOostende Belgium
dc.source.endpage92
dc.title

Post dry-etch cleaning issues of an organic low-K dielectric

dc.typeProceedings paper
dspace.entity.typePublication
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