Publication:

Experimental characterization and model validation of liquid jet impingement cooling using a high spatial resolution and programmable thermal test chip

Date

 
dc.contributor.authorWei, Tiwei
dc.contributor.authorOprins, Herman
dc.contributor.authorCherman, Vladimir
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorBeyne, Eric
dc.contributor.authorBaelmans, Tine
dc.contributor.imecauthorWei, Tiwei
dc.contributor.imecauthorOprins, Herman
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecOprins, Herman::0000-0003-0680-4969
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-27T23:23:36Z
dc.date.available2021-10-27T23:23:36Z
dc.date.issued2019
dc.identifier.issn1359-4311
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/34432
dc.identifier.urlhttps://www.sciencedirect.com/science/article/pii/S1359431118332885
dc.source.beginpage308
dc.source.endpage318
dc.source.journalApplied Thermal Engineering
dc.source.volume152
dc.title

Experimental characterization and model validation of liquid jet impingement cooling using a high spatial resolution and programmable thermal test chip

dc.typeJournal article
dspace.entity.typePublication
Files
Publication available in collections: