Publication:
Test impact on the overall die-to-wafer 3D stacked IC cost
Date
| dc.contributor.author | Taouil, Mottaqiallah | |
| dc.contributor.author | Hamdioui, Said | |
| dc.contributor.author | Beenakker, Kees | |
| dc.contributor.author | Marinissen, Erik Jan | |
| dc.contributor.imecauthor | Marinissen, Erik Jan | |
| dc.contributor.orcidimec | Marinissen, Erik Jan::0000-0002-5058-8303 | |
| dc.date.accessioned | 2021-10-20T16:48:05Z | |
| dc.date.available | 2021-10-20T16:48:05Z | |
| dc.date.issued | 2012-02 | |
| dc.identifier.issn | 0923-8174 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/21593 | |
| dc.identifier.url | http://dx.doi.org/10.1007/s10836-011-5270-3 | |
| dc.source.beginpage | 15 | |
| dc.source.endpage | 25 | |
| dc.source.issue | 1 | |
| dc.source.journal | Journal of Electronic Testing - Theory and Applications (JETTA) | |
| dc.source.volume | 28 | |
| dc.title | Test impact on the overall die-to-wafer 3D stacked IC cost | |
| dc.type | Journal article | |
| dspace.entity.type | Publication | |
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