Publication:
A novel resistance measurement methodology for in-situ UBM/Solder interfacial reaction monitoring
Date
| dc.contributor.author | Hou, Lin | |
| dc.contributor.author | Derakhshandeh, Jaber | |
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.author | De Wolf, Ingrid | |
| dc.contributor.imecauthor | Hou, Lin | |
| dc.contributor.imecauthor | Derakhshandeh, Jaber | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.imecauthor | De Wolf, Ingrid | |
| dc.contributor.orcidimec | Derakhshandeh, Jaber::0000-0003-2448-9165 | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.contributor.orcidimec | De Wolf, Ingrid::0000-0003-3822-5953 | |
| dc.date.accessioned | 2021-10-28T22:37:33Z | |
| dc.date.available | 2021-10-28T22:37:33Z | |
| dc.date.issued | 2020 | |
| dc.identifier.issn | 2156-3950 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/35283 | |
| dc.identifier.url | https://ieeexplore.ieee.org/abstract/document/8887532 | |
| dc.source.beginpage | 30 | |
| dc.source.endpage | 38 | |
| dc.source.issue | 1 | |
| dc.source.journal | IEEE Transactions on Components, Packaging and Manufacturing Technology | |
| dc.source.volume | 10 | |
| dc.title | A novel resistance measurement methodology for in-situ UBM/Solder interfacial reaction monitoring | |
| dc.type | Journal article | |
| dspace.entity.type | Publication | |
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