Publication:

Study on processing step uniformity tuning during FET fabrication and sensor wafer response as a function of chuck temperature adjustment

Date

2014
Journal article
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dc.contributor.authorMilenin, Alexey
dc.contributor.authorBoullart, Werner
dc.contributor.authorWen, Youxian
dc.contributor.authorQuli, Farhat
dc.contributor.imecauthorMilenin, Alexey
dc.contributor.imecauthorBoullart, Werner
dc.contributor.orcidimecMilenin, Alexey::0000-0003-0747-0462
dc.contributor.orcidimecBoullart, Werner::0000-0001-7614-2097
dc.date.accessioned2021-10-22T03:47:42Z
dc.date.available2021-10-22T03:47:42Z
dc.date.embargo9999-12-31
dc.date.issued2014
dc.identifier.issn0021-4922
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/24251
dc.identifier.urlhttp://dx.doi.org/10.7567/JJAP.53.03DC02
dc.source.beginpage03DC02
dc.source.issue3
dc.source.journalJapanese Journal of Applied Physics
dc.source.volume53
dc.title

Study on processing step uniformity tuning during FET fabrication and sensor wafer response as a function of chuck temperature adjustment

dc.typeJournal article
dspace.entity.typePublication
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