Impact of organic linking and terminal groups on the mechanical properties of self-assembly based low-k dielectrics

dc.contributor.author	Vanstreels, Kris
dc.contributor.author	Krishtab, Mikhail
dc.contributor.author	Garcia Gonzalez, Laura
dc.contributor.author	Armini, Silvia
dc.contributor.imecauthor	Vanstreels, Kris
dc.contributor.imecauthor	Krishtab, Mikhail
dc.contributor.imecauthor	Armini, Silvia
dc.contributor.orcidimec	Vanstreels, Kris::0000-0002-4420-0966
dc.contributor.orcidimec	Armini, Silvia::0000-0003-0578-3422
dc.date.accessioned	2021-10-24T17:18:55Z
dc.date.available	2021-10-24T17:18:55Z
dc.date.issued	2017
dc.identifier.issn	0003-6951
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/29793
dc.identifier.url	http://aip.scitation.org/doi/full/10.1063/1.4993088
dc.source.beginpage	161906
dc.source.issue	16
dc.source.journal	Applied Physics Letters
dc.source.volume	111
dc.title	Impact of organic linking and terminal groups on the mechanical properties of self-assembly based low-k dielectrics
dc.type	Journal article
dspace.entity.type	Publication
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