Publication:

Metrology and inspection requirements for 3D stacking of ICs

Date

2012
Proceedings Paper
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dc.contributor.authorHalder, Sandip
dc.contributor.authorMiller, Andy
dc.contributor.authorMaenhoudt, Mireille
dc.contributor.authorBeyer, Gerald
dc.contributor.authorSwinnen, Bart
dc.contributor.authorBeyne, Eric
dc.contributor.authorGrant, David
dc.contributor.authorMarx, David
dc.contributor.authorDudley, Russ
dc.contributor.authorFord, Maurice
dc.contributor.imecauthorHalder, Sandip
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorSwinnen, Bart
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecHalder, Sandip::0000-0002-6314-2685
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-20T11:25:34Z
dc.date.available2021-10-20T11:25:34Z
dc.date.issued2012
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/20770
dc.source.beginpage615
dc.source.conference62nd Electronic Components and Technology Conference - ECTC
dc.source.conferencedate29/05/2012
dc.source.conferencelocationSan Diego, CA USA
dc.source.endpage618
dc.title

Metrology and inspection requirements for 3D stacking of ICs

dc.typeProceedings paper
dspace.entity.typePublication
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