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A five layer thin film MCM-Si design using oxynitride dielectrics

Date

1997
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dc.contributor.authorLernout, Jo
dc.contributor.authorVanfleteren, Jan
dc.contributor.authorVan Calster, Andre
dc.contributor.authorSchols, G.
dc.contributor.imecauthorVanfleteren, Jan
dc.contributor.imecauthorVan Calster, Andre
dc.contributor.orcidimecVanfleteren, Jan::0000-0002-9654-7304
dc.date.accessioned2021-09-30T09:17:03Z
dc.date.available2021-09-30T09:17:03Z
dc.date.issued1997
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/1987
dc.source.conferenceIMAPS/NATO Advanced Research Workshop on Electronic Packaging for High Reliability, Low Cost Electronics; May 1997; Bled, Sloven
dc.source.conferencelocation
dc.title

A five layer thin film MCM-Si design using oxynitride dielectrics

dc.typeOral presentation
dspace.entity.typePublication
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