Cobalt-Tin Intermetallic Compounds as Alternative Surface Finish for Low Temperature Die-to-Wafer Solder Stacking

dc.contributor.author	Inoue, Fumihiro
dc.contributor.author	Derakhshandeh, Jaber
dc.contributor.author	Gerets, Carine
dc.contributor.author	Beyne, Eric
dc.contributor.imecauthor	Inoue, Fumihiro
dc.contributor.imecauthor	Derakhshandeh, Jaber
dc.contributor.imecauthor	Gerets, Carine
dc.contributor.imecauthor	Beyne, Eric
dc.contributor.orcidimec	Derakhshandeh, Jaber::0000-0003-2448-9165
dc.contributor.orcidimec	Beyne, Eric::0000-0002-3096-050X
dc.date.accessioned	2022-01-31T10:18:13Z
dc.date.available	2021-12-03T02:05:59Z
dc.date.available	2022-01-31T10:18:13Z
dc.date.issued	2021
dc.identifier.eisbn	978-4-9911911-0-7
dc.identifier.issn	na
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/38524
dc.publisher	IEEE
dc.source.beginpage	9
dc.source.conference	20th International Conference on Electronics Packaging (ICEP)
dc.source.conferencedate	MAY 12-14, 2021
dc.source.conferencelocation	Tokyo
dc.source.endpage	10
dc.source.journal	na
dc.source.numberofpages	2
dc.title	Cobalt-Tin Intermetallic Compounds as Alternative Surface Finish for Low Temperature Die-to-Wafer Solder Stacking
dc.type	Proceedings paper
dspace.entity.type	Publication
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