Publication:

Experimental and Numerical Study of 3-D Printed Direct Jet Impingement Cooling for High-Power, Large Die Size Applications

Date

2021
Journal article
https://doi.org/10.1109/TCPMT.2020.3045113
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dc.contributor.authorWei, Tiwei
dc.contributor.authorOprins, Herman
dc.contributor.authorCherman, Vladimir
dc.contributor.authorYang, Zhi
dc.contributor.authorRivera, Kathryn C.
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorEngland, Luke
dc.contributor.authorBaelmans, Martine
dc.contributor.authorPawlak, Bartek
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorWei, Tiwei
dc.contributor.imecauthorOprins, Herman
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorPawlak, Bartek
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecWei, Tiwei::0000-0003-3167-1440
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecOprins, Herman::0000-0003-0680-4969
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.date.accessioned2022-03-02T10:18:28Z
dc.date.available2022-03-02T10:18:28Z
dc.date.issued2021
dc.identifier.doi10.1109/TCPMT.2020.3045113
dc.identifier.issn2156-3950
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/39216
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
dc.source.beginpage415
dc.source.endpage425
dc.source.issue3
dc.source.journalIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
dc.source.numberofpages11
dc.source.volume11
dc.subject.keywordsMANIFOLDS
dc.subject.keywordsDESIGN
dc.title

Experimental and Numerical Study of 3-D Printed Direct Jet Impingement Cooling for High-Power, Large Die Size Applications

dc.typeJournal article
dspace.entity.typePublication
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